• Aurora Effect in Snowy Landscape Creates Multi-layered Soft Lighting
• Precise 2mm CNC Heat Spreader for Enhanced Heat Dissipation
• The Best Choice for White-themed Builds
• Premium 10-layer anti-interference board
• Improved PMIC heat dissipation design
• Innovative Circuit Structure Patent Reduces Power Consumption and Heat
  • (Invention patent number in Taiwan: I842298; Invention patent number in the US: US12111715B2)
• Patented IC Grading Method for Memory Ensures Applicability and Durability
  • (Invention patent number in Taiwan: I751093; Invention patent number in the US: US11488679B1)
• Lifetime warranty

CAUTION

• Before purchasing memory products, please refer to the QVL(Qualified Vendor List) compatibility list first of the motherboard.
• The quality of the CPU memory controller (IMC) and the version from the BIOS of motherboard may both potentially affect the operating frequency of the memory.
• The overclocking memory with high frequency needs a more enhanced heat solution inside the case, to bring out better stability.
• Do not mix memory modules of different capacities, frequencies, brands, or models. Each memory kit is paired through compatibility testing. Mixing different kits may cause system instability or failure to boot.
• Memory kits labeled “Support Intel XMP 3.0” only include XMP Profiles. Kits labeled “Support AMD EXPO” only include EXPO Profiles. Kits labeled “COMBINATION Intel XMP/AMD EXPO” include both XMP and EXPO Profiles.
• If the system fails to boot, reset the motherboard CMOS, enter BIOS with default frequency, and then enable the Profile to retry system boot.
• Failure to install and use the memory as per the official specifications, warnings, or operating instructions may result in the memory not operating at the speed indicated on the packaging, system instability, or damage to other hardware.